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Marke: Semikron Danfoss
Verfügbarkeit: ca. 19-21 Wochen Lieferzeit
| Chip technology | IGBT 3 (Trench) |
| Country of origin | Slovakia |
| Current (A) | 75A |
| Dimensions (LxWxH) | 59x52x16 |
| Housing | MiniSKiiP II 2 |
| Product line | MiniSKiiP |
| Product Status | In Production New |
| Technology | IGBT |
| Topology | 3-Level |
| Variant | Standard lid and HPTP |
| Variant Description | The SKiiP 26MLI07E3V1-M25 is a 650 V IGBT module and comes with a 6.5mm height standard pressure lid and pre-applied High Performance Thermal Paste (HPTP, ?=2.5 W/mK). HPTP is a silicone-based thermal paste that offers outstanding thermal performance and maximizes the module's output power or significantly increases the module lifetime. |
| Variant Short Description | Module + Standard Pressure Lid + High Performance Thermal Paste (HPTP) |
| Variants | 25232800M00;25232800M01;25232800M10;25232800M11;25232800M20;25232800M21;25232800M25;25232800 |
| Voltage (V) | 650V |

€ 267,33
€ 267,33
€ 212,83
€ 212,83
€ 374,67
€ 374,67
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