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Marke: Semikron Danfoss
Verfügbarkeit: ca. 27 Wochen Lieferzeit
| Chip technology | IGBT 3 (Trench) |
| Country of origin | Italy |
| Current (A) | 30A |
| Dimensions (LxWxH) | 63x34x12 |
| Housing | SEMITOP E1 |
| Product line | SEMITOP |
| Product Status | In Production |
| Technology | IGBT |
| Topology | CIB |
| Variant | HPTP |
| Variant Description | The SK30DGDL07E3ETE1-M05 is a 650 V IGBT module and comes with High Performance Thermal Paste (HPTP, ?=2.5 W/mK). HPTP is a silicone-based thermal paste that offers outstanding thermal performance and maximizes the module's output power or significantly increases the module lifetime. |
| Variant Short Description | Module + High Performance Thermal Paste (HPTP) |
| Variants | 24922730VM05;24922730VM07;24922730 |
| Voltage (V) | 650V |
€ 267,33
€ 267,33
€ 212,83
€ 212,83
€ 374,67
€ 374,67
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